2012 | "Copper electroless plating in weakly alkaline electrolytes using DMAB…
페이지 정보
작성자 관리자 / 작성일2015-08-25 / 조회964회첨부파일
- Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films.pdf (1.1M) 114회 다운로드 DATE : 2015-08-25 11:43:04
본문
Title : Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Authors: Nadiia Kulyk, Serhiy Cherevk, and Chan-Hwa Chung
Journal : Electrochimica Acta
Vol/Page : 59/179-185
DOI : 10.1016/j.electacta.2011.10.053
Abstract :
Copper electroless plating at low pH (7-9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on the pH of the solution. The effects of altering the mechanism on the resulting film conductivity, morphology and adhesion are studied on copper films deposited onto a polyimide (PI) substrate.
Authors: Nadiia Kulyk, Serhiy Cherevk, and Chan-Hwa Chung
Journal : Electrochimica Acta
Vol/Page : 59/179-185
DOI : 10.1016/j.electacta.2011.10.053
Abstract :
Copper electroless plating at low pH (7-9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on the pH of the solution. The effects of altering the mechanism on the resulting film conductivity, morphology and adhesion are studied on copper films deposited onto a polyimide (PI) substrate.