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2010 | "Study on electrochemical mechanical polishing process of copper circu…

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작성자 관리자 /   작성일2015-08-25 /   조회927회

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Title : Study on electrochemical mechanical polishing process of copper circuit on PCB
Authors: Nadiia Kulyk,Chang Yong An,Jung Hoon Oh,Sung Min Cho,Changsup Ryu,Young Kwan Ko, and Chan-Hwa Chung

Journal : Korean Journal of Chemical Engineering
Vol/No/Page : 27/1/310-314
DOI : 10.1007/s11814-009-0289-1

Abstract :
As an alternative to conventional chemical mechanical polishing (CMP) for the planarization of copper
layers on electronic circuits, the electrochemical mechanical polishing (ECMP) process in alkali-based solution was investigated in this work. The influence of the polishing pad materials on the polishing process was studied, and the hard polyurethane polishing pad was shown to eliminate the “dishing effect”. The polishing conditions, such as the pad rotating speed, concentration of H2O2, and the amount of BTA additives were optimized to control the planarization performance. As a result, good planarization uniformity was obtained not only in small scale (30 μm) trenches but also in very large scale (a few mm) patterns with a single step ECMP process.

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