Title : Control of Topographical Selectivity in Palladium-Activated Electroless Copper Metallization
Authors: Youn-Jin Oh, Sung Min Cho, and Chan-Hwa Chung

Journal : Electrochemical and Solid-State Letters
Vol/No/Page : 8/1/C1-C3
DOI : 10.1149/1.1825291

Abstract :
From our study on copper electroless deposition, we have successfully controlled selective copper growing only in vias and trenches of Formula  and Formula  substrates by adapting the accelerating and inhibiting effects of additives and modulating the condition of palladium activation. Formula -Dipyridyl and polyethylene glycol play a significant role of inhibitor and accelerator, which contributed to the selective growing during the electroless deposition process. Furthermore, we found that the postcleaning conditions of deionized water rinsing and Formula  blowing after Pd activation also strongly affects the topographical selectivity of copper growing in our electroless deposition.